Semiconductor & Optoelectronics Device

Core parts cover

Water transfer robot stage arms. vacuum chamber components

Precision positioning stage base plates, optical lens barrels/mounts

Probe card test sockets, chip test fixtures

Laser heat sink bases, optical module structure components

Drawbacks

Extremely high requirements stability requirements (no deformation over time)

Strictly cleanliness requirements -no oil,no dust ,no machining burrs

Some materials are imported pre- stressed aluminum plates /stainless steel -expensive .with high scrap costs

Stress-free machining required -residual stress release leads to parts distortion

Extremely tight flatness /parallelism requirements (typically 0.005mm-0.01mm/100mm)

Our Approach

Select imported aluminum plates (MIC -6/AL-CA5)or pre- stressed stainless steel with full stress relief

Add secondary stress-relief treatment before machining (Artificial aging or cryogenic treatment)

Precision grinding ensures flatness/parallelism within 0.01mm

Finished parts undergo ultrasonic cleaning +dust -free drying -Class 1000cleanroom packaging

Inspection conducted in a temperature-controlled environment(20+/-1°C) to eliminate temperature -induced measurement errors

Case

We machined critical connecting bases for wafer transfer robot arms for a Italy semiconductor equipment manufacturer.The material was 7075-T651aluminum alloy ,requiring positional tolerance of Φ0.015mm across four mounting holes and flatness of 0.008mm.By completing all hole systems in a single 5-axis setup and verifying with ZEISS CMM.we achieved full inspection approval-and have maintained stable cooperation for over 2 years .